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PHOTOCOUPLER
PS2581L1,PS2581L2
LONG CREEPAGE TYPE HIGH ISOLATION VOLTAGE 4-PIN PHOTOCOUPLER -NEPOC
Series-
DESCRIPTION
The PS2581L1, PS2581L2 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic DIP (Dual In-line Package). Creepage distance and clearance of leads are over 8 millimeters. The PS2581L2 is lead bending type (Gull-wing) for surface mounting.
FEATURES
* Long creepage and clearance distance (8 mm) * High isolation voltage (BV = 5 000 Vr.m.s.) * High collector to emitter voltage (VCEO = 80 V) * High-speed switching (tr = 3 s TYP., tf = 5 s TYP.) * High current transfer ratio (CTR = 200 % TYP.) * Safety standards * UL approved: File No. E72422 * CSA approved: No. CA101391 * BSI approved: No. 8243/8244 * NEMKO approved: No. P97103006 * DEMKO approved: No. 307269 * SEMKO approved: No. 304666 * FIMKO approved: No. FI 19424 * DIN EN60747-5-2 (VDE0884 Part2) approved
APPLICATIONS
* Power supply * Telephone/FAX. * FA/OA equipment * Programmable logic controller
Document No. PN10239EJ02V0DS (2nd edition) Date Published March 2006 CP(K)
The mark
shows major revised points. (c) NEC Compound Semiconductor Devices, Ltd. 1997, 2006
PS2581L1,PS2581L2
PACKAGE DIMENSIONS (in millimeters)
PS2581L1
4.60.35 1.00.2 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 10.16 7.62
3.20.4
4.150.4
0.35
3.50.3
6.5+0.5 -0.1
2.54
0.500.1 0.25 M 0 to 15
1.250.15
PS2581L2
4.60.35 1.00.2 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2
6.5+0.5 -0.1
10.16 7.62
3.50.3 0.250.2
1.250.15 0.25 M
0.90.25 2.54 12.0 MAX.
PHOTOCOUPLER CONSTRUCTION
Parameter Air Distance Outer Creepage Distance Inner Creepage Distance Isolation Distance Unit (MIN.) 8 mm 8 mm 4 mm 0.4 mm
2
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
MARKING EXAMPLE
No. 1 pin Mark
2581 NJ601
Assembly Lot VDE Mark
N
J
6 01
Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code
Package New PKG
Made in Japan Made in Taiwan J K
Data Sheet PN10239EJ02V0DS
3
PS2581L1,PS2581L2
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification PS2581L1 PS2581L2 PS2581L2-E3 PS2581L2-E4 PS2581L1-A PS2581L2-A PS2581L2-E3-A PS2581L2-E4-A Embossed Tape 1 000 pcs/reel Pb-Free Magazine case 100 pcs Packing Style Safety Standard Approval Standard products (UL, CSA, BSI, NEMKO, SEMKO, DEMKO, FIMKO, DIN EN60747-5-2 (VDE0884 Part2) Approved products) Application *1 Part Number PS2581L1 PS2581L2
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Derating Power Dissipation Peak Forward Current Transistor
*1
Symbol IF VR
Ratings 80 6 1.5 150 1 80 7 50 1.5 150 5 000 -55 to +100 -55 to +150
Unit mA V mW/C mW A V V mA mW/C mW Vr.m.s. C C
PD/C
PD IFP VCEO VECO IC
Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation
PC/C
PC BV TA Tstg
Isolation Voltage
*2
Operating Ambient Temperature
Storage Temperature
*1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together.
4
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Transistor Coupled Collector to Emitter Dark Current Current Transfer Ratio (IC/IF) Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Time Fall Time
*2 *1
Symbol VF IR Ct ICEO CTR VCE(sat) RI-O CI-O tr tf IF = 10 mA VR = 5 V
Conditions
MIN.
TYP. 1.17
MAX. 1.4 5
Unit V
A
pF
V = 0 V, f = 1.0 MHz VCE = 80 V, IF = 0 mA IF = 5 mA, VCE = 5 V IF = 10 mA, IC = 2 mA VI-O = 1.0 kVDC V = 0 V, f = 1.0 MHz VCC = 10 V, IC = 2 mA, RL = 100 10
11
50 100 80 200 400 0.3
nA % V
0.5 3 5
pF
s
*2
*1 CTR rank L : 200 to 400 (%) M : 80 to 240 (%) D : 100 to 300 (%) H : 80 to 160 (%) W : 130 to 260 (%) N : 80 to 400 (%) *2 Test circuit for switching time
Pulse Input PW = 100 s Duty Cycle = 1/10 IF 50 VOUT RL = 100 VCC
Data Sheet PN10239EJ02V0DS
5
PS2581L1,PS2581L2
TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified)
DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
150
150
Diode Power Dissipation PD (mW)
100
100
50
50
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100 50
Forward Current IF (mA)
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
70
Collector Current IC (mA)
TA = +100 C +60 C +25 C
60 50 40
50 mA
10 5 0 C -25 C -55 C
1 0.5
30 20 10
20
mA A m 10
IF = 5 mA
0.1 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
0
2
4
6
8
10
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE
Collector to Emitter Dark Current ICEO (nA)
COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE
40
50 mA 20 mA 10 mA
5 mA
2 mA
10 000
Collector Current IC (mA)
1 000
VCE = 80 V 40 V 24 V 10 V 5V
10 5
100
1 0.5
IF = 1 mA
10
1 - 50 -25 0 25 50 75 100
0.1 0
0.2
0.4
0.6
0.8
1.0
Ambient Temperature TA (C)
Collector Saturation Voltage VCE(sat) (V)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs. FORWARD CURRENT
450 400 350 300 250 200 150 100 50 0 0.05 0.1 0.5 1 5 10 50
;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 1.0 ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 0.8 ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; ;;;;;;;;;;;;;;;;;;;;;;;; 0.6
1.2 0.4 0.2 0 Normalized to 1.0 at TA = 25 C, IF = 5 mA, VCE = 5 V -50 -25 0 25 50 75 100
Ambient Temperature TA (C)
Forward Current IF (mA)
SWITCHING TIME vs. LOAD RESISTANCE
50 IC = 2 mA, VCC = 10 V, CTR = 290 %
Switching Time t ( s)
SWITCHING TIME vs. LOAD RESISTANCE
1 000 IF = 5 mA, VCC = 5 V, CTR = 290 %
Switching Time t ( s)
tf tr 100
tf
10 td ts 1
ts
10
tr 0.1 10 50 100 500 1 k 5 k 10 k 1 100 td 500 1 k 5 k 10 k 50 k 100 k
Load Resistance RL ()
Load Resistance RL ()
FREQUENCY RESPONSE
CTR Degradation (Relative Value)
LONG TERM CTR DEGRADATION
1.2 TYP. 1.0 0.8 0.6 0.4 0.2 0 IF = 5 mA TA = 60 C IF = 5 mA TA = 25 C
0
Normalized Gain GV
IF = 5 mA, VCE = 5 V
-5 -10 -15 RL = 1 k -20 300 0.5 1 2 5 10 20 50 100 200 500
100
102
103 Time (Hr)
104
105
Frequency f (kHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10239EJ02V0DS
7
PS2581L1,PS2581L2
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
4.40.2
11.50.1
2.050.1 12.00.1
6.60.2
0.38
Tape Direction
PS2581L2-E3 PS2581L2-E4
Outline and Dimensions (Reel)
12.350.15
24.00.3
2.00.5
B 3302.0
2.00.5 B13.00.2
R 1.0
B 21.00.8
B 1001.0
25.51.0 29.51.0
Packing: 1 000 pcs/reel
23.9 to 27.4 Outer edge of flange
8
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C.
Data Sheet PN10239EJ02V0DS
9
PS2581L1,PS2581L2
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. This tendency may sometimes be obvious, especially below IF = 1 mA. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
10
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
Parameter Application classification (DIN VDE 0109) for rated line voltages 300 Vr.m.s. for rated line voltages 600 Vr.m.s. Climatic test class (DIN IEC 68 Teil 1/09.80) Dielectric strength maximum operating isolation voltage. Test voltage (partial discharge test procedure a for type test and random test) Upr = 1.2 x UIORM, Pd < 5 pC Test voltage (partial discharge test procedure b for all devices test) Upr = 1.6 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN VDE 0109) Clearance distance Creepage distance Comparative tracking index (DIN IEC 112/VDE 0303 part 1) Material group (DIN VDE 0109) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25 C VIO = 500 V dc at TA MAX. at least 100 C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = 175 C (Tsi) Ris MIN. 10
9
Symbol
Speck
Unit
IV III 55/100/21 UIORM Upr 890 1 068 Vpeak Vpeak
Upr
1 424
Vpeak
UTR
8 000 2 > 8.0 > 8.0
Vpeak
mm mm
CTI
175 III a
Tstg TA
-55 to +150 -55 to +100
12 11
C C
Ris MIN. Ris MIN.
10 10
Tsi Isi Psi
175 400 700
C mA mW
Data Sheet PN10239EJ02V0DS
11
PS2581L1,PS2581L2
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
12
Data Sheet PN10239EJ02V0DS
PS2581L1,PS2581L2
This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
Caution
GaAs Products
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
0504
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
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